Elektronik, Elektro und Unterhaltungselektronik

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Feb
01

New Palladium Coated Copper Wire (PdPRo) for IC Applications

– The new palladium coated copper wire (PdPRo) has a robust Free Air Ball quality at a wide range of the gas flow rate – PdPRo has a higher stitch pull and a wider 2nd bond process window PdPRo is a palladium coated copper wire that contains copper as a main component and palladium as … Weiterlesen »

Jan
18

Heraeus launches new Silver Alloy Bonding Wire (AgLite)

AgLite is a cost-effective alternative replacement to gold wire With the recent trend towards using wires made from materials other than gold, Heraeus announces the introduction of AgLite. It is a silver alloy wire that contains silver as the main component and other important elements. With this introduction Heraeus expands its portfolio of non-gold bonding … Weiterlesen »

Apr
17

Heraeus licensed for the patents related to Nippon Micrometal

The Heraeus business group Heraeus Materials Technology announces that it has been licensed for Nippon Micrometal“s patents related to Palladium Coated Copper Technology. Nippon Micrometal, a subsidiary of Nippon Steel Materials, is the world-wide market leader for palladium coated copper wire. The Semiconductor industry of late has been rapidly adopting Copper and / or Palladium … Weiterlesen »

Mrz
28

Heraeus Launches RelCu

The RelCu is a corrosion resistance Copper Bonding Wire. It is a superior alternative to the current Pd coated Cu technology Heraeus Materials Technology announced the launch of RelCu – a new proprietary alloyed Copper wire developed and specially designed for the market demanding improved reliability performance. („Rel“ stands for high reliability). „RelCu provides customers … Weiterlesen »