Elektronik, Elektro und Unterhaltungselektronik

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Apr
20

New generation of Debonders and Warpage Adjusters boosts productivity

MUNICH, April 20, 2016 – ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, is introducing two new innovative products. The systems are targeting the thermal debonding and warpage adjusting in eWLB (embedded Wafer Level Ball Grid Array) processes for 300/330 mm wafer processing. With their innovative features, … Weiterlesen »

Sep
27

ERS Competence Center celebrates fifth anniversary

High customer acceptance, rising number of application areas (Source: ERS electronic GmbH) MUNICH, September 27, 2016 – ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, looks back to five extraordinary successful years of operating its Fan-out Wafer Level Packaging (FOWL) test competence center in Munich. The center … Weiterlesen »

Sep
01

ERS showcases Thermal Chuck and eWLB Test Product Line-up at Semicon Taiwan

Semicon Taiwan: Booth 2522, 1st floor (Source: ERS electronic GmbH) MUNICH, September 1, 2016 – ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, will showcase its product line at the Semicon Taiwan trade fair (September 7 – 9). At the exhibition, ERS shares its stand with its … Weiterlesen »

Aug
02

ERS ready for imminent eWLB upswing

Emerging semiconductor manufacturing technology (Source: ERS electronic GmbH) MUNICH, August 2, 2016 – ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, sees excellent growth opportunities in the emerging eWLB / FOWLP (Fan Out Wafer Level Packaging) advanced packaging technology. ERS expects this market to grow at a … Weiterlesen »