Elektronik, Elektro und Unterhaltungselektronik

Kostenlose Pressemitteilungen zu Elektronik und Elektro

Nov
02

ERS zeigt innovative Backend-Verfahren auf der Semicon Europa

München, 2. November 2017 – Die ERS electronic GmbH, Innovationsführer im Markt thermischer Testlösungen für die Halbleiterfertigung, präsentiert auf der Semicon Europa ihre innovative Technologie. Zusammen mit der parallel stattfindenden Weltleitmesse Productronica ist die Veranstaltung der größte Treffpunkt für Mikroelektronik in Europa. Für die zahlreichen europäischen Kunden von ERS ist dies eine hervorragende Gelegenheit, sich … Weiterlesen »

Jul
18

ERS appoints seasoned expert to fill new CSMO position

New Chief Sales and Marketing Officer at ERS electronic GmbH: Laurent Giai-Miniet (Source: Laurent Giai-Miniet) MUNICH, 18 July, 2017 – Effective immediately, Laurent Giai-Miniet is the new Chief Sales and Marketing Officer (CSMO) at ERS electronic GmbH, the world leading provider of thermal test solutions for semiconductor manufacturing. Laurent Giai-Miniet brings more than 25 years … Weiterlesen »

Apr
20

New generation of Debonders and Warpage Adjusters boosts productivity

MUNICH, April 20, 2016 – ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, is introducing two new innovative products. The systems are targeting the thermal debonding and warpage adjusting in eWLB (embedded Wafer Level Ball Grid Array) processes for 300/330 mm wafer processing. With their innovative features, … Weiterlesen »

Sep
27

ERS Competence Center celebrates fifth anniversary

High customer acceptance, rising number of application areas (Source: ERS electronic GmbH) MUNICH, September 27, 2016 – ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, looks back to five extraordinary successful years of operating its Fan-out Wafer Level Packaging (FOWL) test competence center in Munich. The center … Weiterlesen »

Sep
01

ERS showcases Thermal Chuck and eWLB Test Product Line-up at Semicon Taiwan

Semicon Taiwan: Booth 2522, 1st floor (Source: ERS electronic GmbH) MUNICH, September 1, 2016 – ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, will showcase its product line at the Semicon Taiwan trade fair (September 7 – 9). At the exhibition, ERS shares its stand with its … Weiterlesen »

Aug
02

ERS ready for imminent eWLB upswing

Emerging semiconductor manufacturing technology (Source: ERS electronic GmbH) MUNICH, August 2, 2016 – ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, sees excellent growth opportunities in the emerging eWLB / FOWLP (Fan Out Wafer Level Packaging) advanced packaging technology. ERS expects this market to grow at a … Weiterlesen »