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Dynamic Thermal Shield: Higher Throughput and More Reliable Results in Wafer Test

ERS at Semicon Japan 2015 MUNICH, December 2, 2015 – ERS electronic GmbH, technology leader in air-cooled chuck systems for semiconductor manufacturing, is announcing a technology break-through that significantly improves measurement precision during wafer test. ERS electronic”s new Dynamic Thermal Shield (DTS) helps semiconductor manufacturers to achieve better test results faster. DTS is an add-on … Weiterlesen »