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Sep
27

ERS Competence Center celebrates fifth anniversary

High customer acceptance, rising number of application areas (Source: ERS electronic GmbH) MUNICH, September 27, 2016 – ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, looks back to five extraordinary successful years of operating its Fan-out Wafer Level Packaging (FOWL) test competence center in Munich. The center … Weiterlesen »

Sep
01

ERS showcases Thermal Chuck and eWLB Test Product Line-up at Semicon Taiwan

Semicon Taiwan: Booth 2522, 1st floor (Source: ERS electronic GmbH) MUNICH, September 1, 2016 – ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, will showcase its product line at the Semicon Taiwan trade fair (September 7 – 9). At the exhibition, ERS shares its stand with its … Weiterlesen »

Dez
02

Dynamic Thermal Shield: Higher Throughput and More Reliable Results in Wafer Test

ERS at Semicon Japan 2015 MUNICH, December 2, 2015 – ERS electronic GmbH, technology leader in air-cooled chuck systems for semiconductor manufacturing, is announcing a technology break-through that significantly improves measurement precision during wafer test. ERS electronic”s new Dynamic Thermal Shield (DTS) helps semiconductor manufacturers to achieve better test results faster. DTS is an add-on … Weiterlesen »

Feb
16

Fujitsu Semiconductor and Rohde & Schwarz Extend Long-Standing Cooperation for Customized SoCs

Parties signed contract for development of a 28nm System on Chip for Rohde & Schwarz test and measurement instruments Fujitsu Semiconductor and Rohde & Schwarz extend long-standing cooperation. Langen & Munich, Germany, February 16, 2015 – Fujitsu Semiconductor Europe (FSEU) and Rohde & Schwarz (R&S) signed a contract to extend their long-standing cooperation. The partnership … Weiterlesen »

Dez
09

Fujitsu stellt Ultra-Low-Power-FRAM mit integrierter Zählerfunktion vor

Perfekt abgestimmt auf Sensor- und Energy-Harvesting-Anwendungen in der Industrieautomation Fujitsu stellt Ultra-Low-Power-FRAM mit integrierter Zählerfunktion vor. Langen, Deutschland, 9. Dezember 2014 – Fujitsu Semiconductor Europe (FSEU) stellt heute den neuen FRAM-Baustein MB85RDP16LX vor, der extrem stromsparend arbeitet und mit einem integrierten Binärzähler ausgestattet ist. Das neue Produkt überzeugt mit zahlreichen Optimierungen: Verglichen mit Standard-FRAM-Lösungen liegt … Weiterlesen »

Dez
08

Fujitsu Introduces Ultra-Low-Power FRAM with Integrated Counter Function

A perfect match for sensor and energy harvesting applications in industrial automation Fujitsu introduces an ultra-low-power FRAM with an integrated counter function. Langen, Germany, December 8th, 2014 – Fujitsu Semiconductor Europe (FSEU) today announced the release of MB85RDP16LX, an ultra-low-power FRAM device with an integrated binary counter function. The new device incorporates multiple optimisations to … Weiterlesen »

Sep
18

Photokina 2014: Leica and Fujitsu Semiconductor Extend Long-Standing Cooperation Focusing on Next Generation SoC

Parties sign letter of intent on photo trade fair, will extend longstanding development relationship Leica and Fujitsu Semiconductor sign letter of intent on photokina 2014 to extend cooperation. Langen, Germany, September 18, 2014 – Leica Camera AG (“Leica”) and Fujitsu Semiconductor Europe (FSEU) today signed a letter of intent, expressing their plans to extend their … Weiterlesen »

Sep
16

Photokina 2014: Leica to Present New High-End Camera Leica S Featuring Leica MAESTRO II Processor built on Fujitsu Technology

Joint presence at leading photo trade fair from September 16 – 21, 2014, underscores longstanding development relationship Leica to present new Leica S high-end camera featuring Leica MAESTRO II image processor at Photokina Langen, Germany, September 16, 2014 – Leica Camera AG (“Leica”) and Fujitsu Semiconductor Europe (FSEU) will be presenting a new Leica S … Weiterlesen »

Aug
26

Fujitsu stellt SoC-Baustein für die HEVC-HD-Decodierung in Multimedia-Anwendungen vor

Das SoC unterstützt H.265-Decodierung für Set-Top-Boxen und In-Car-Infotainmentsysteme Langen, 26. August 2014 – Fujitsu Semiconductor Europe (FSEU) stellt mit dem MB8AL2030 – Rufname HD62 – eine aktuelle Erweiterung der H6x-Decoderserie vor. Das System on Chip (SoC) unterstützt die HEVC-Decodierung, auch bekannt als H.265-Decodierung, in HD-Auflösung für Multimedia-Anwendungen in In-Car-Infotainment- und Home-Entertainment-Systeme. H.265 ist der Nachfolger … Weiterlesen »

Aug
26

Fujitsu Presents HEVC HD Decoding SoC for Multimedia Applications

SoC supports H.265 decoding for set top boxes and in-car infotainment systems Langen, Germany, August 26, 2014 – Fujitsu Semiconductor Europe (FSEU) today introduced its newest addition to the Fujitsu H6x decoder series: the MB8AL2030 nicknamed HD62. The System on Chip (SoC) supports HEVC (H.265) decoding in HD resolution for multimedia applications in in-car infotainment … Weiterlesen »

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