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Benefits of Soldering with Vacuum Profiles? – Part 3

MID housing Introduction After having described the influence of aperture variations and vacuum on the number of voids and void content in BTCs (bottom terminated components) in parts 1 and 2, a further advantage of the targeted use of vacuum is shown in part 3. As a result of the uniform distribution of the vapor … Weiterlesen »


The Benefits of Soldering with Vacuum Profiles? – Part 2

Helmut Oettl, Head of Application and Product Management, Rehm Thermal Systems Voids with and without vacuum Introduction Now that the issue of soldering with vacuum profiles has been introduced in part 1, we“ll take a closer look at the process and discuss the obtained soldering results in part 2. Figure 1 shows the overall layout … Weiterlesen »