Elektronik, Elektro und Unterhaltungselektronik

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Apr
14

What are the Benefits of Soldering with Vacuum Profiles

Factors which Influence Voids and Reliability (source: Voids Workgroup, Dr. Wohlrabe, TU Dresden) (Source: Voids Workgroup, Dr. Wohlrabe, TU Dresden) Requirements for void-free solder joints are continuously increasing in the field of electronics manufacturing, i.e. the reduction or elimination of cavities in the connection technology used between component connectors and connector pads. New challenges evolve … Weiterlesen »