Elektronik, Elektro und Unterhaltungselektronik

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Sep
27

ERS Competence Center celebrates fifth anniversary

High customer acceptance, rising number of application areas (Source: ERS electronic GmbH) MUNICH, September 27, 2016 – ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, looks back to five extraordinary successful years of operating its Fan-out Wafer Level Packaging (FOWL) test competence center in Munich. The center … Weiterlesen »

Sep
01

ERS showcases Thermal Chuck and eWLB Test Product Line-up at Semicon Taiwan

Semicon Taiwan: Booth 2522, 1st floor (Source: ERS electronic GmbH) MUNICH, September 1, 2016 – ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, will showcase its product line at the Semicon Taiwan trade fair (September 7 – 9). At the exhibition, ERS shares its stand with its … Weiterlesen »