Elektronik, Elektro und Unterhaltungselektronik

Kostenlose Pressemitteilungen zu Elektronik und Elektro

Apr
20

New generation of Debonders and Warpage Adjusters boosts productivity

MUNICH, April 20, 2016 – ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, is introducing two new innovative products. The systems are targeting the thermal debonding and warpage adjusting in eWLB (embedded Wafer Level Ball Grid Array) processes for 300/330 mm wafer processing. With their innovative features, … Weiterlesen »

Feb
22

ERS boosts productivity in FOWLP debonding and wafer testing

Semicon China: Hall W4, Booth 4143-1 ERS’ debonding machines for FOWLP (Fan-out Wafer-Level Packaging) (Source: ERS electronic GmbH) MUNICH, 22 February 2017 – ERS electronic GmbH, the innovation leader in the market of Fan-out Wafer-Level Packaging (FOWLP) debonding and thermal test solutions for semiconductor production, will showcase its latest technology developments at Semicon China in … Weiterlesen »

Aug
02

ERS ready for imminent eWLB upswing

Emerging semiconductor manufacturing technology (Source: ERS electronic GmbH) MUNICH, August 2, 2016 – ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, sees excellent growth opportunities in the emerging eWLB / FOWLP (Fan Out Wafer Level Packaging) advanced packaging technology. ERS expects this market to grow at a … Weiterlesen »

Dez
02

Dynamic Thermal Shield: Higher Throughput and More Reliable Results in Wafer Test

ERS at Semicon Japan 2015 MUNICH, December 2, 2015 – ERS electronic GmbH, technology leader in air-cooled chuck systems for semiconductor manufacturing, is announcing a technology break-through that significantly improves measurement precision during wafer test. ERS electronic”s new Dynamic Thermal Shield (DTS) helps semiconductor manufacturers to achieve better test results faster. DTS is an add-on … Weiterlesen »

Jul
09

Fairchild Semiconductor startet Produktion auf 8″ Wafer-Fertigungslinie in Korea

Fab produziert Energiemanagementlösungen für den weltweiten Markt München – 9. Juli 2013 – Fairchild Semiconductor (NYSE: FCS), ein weltweit führender Anbieter von Halbleiterbausteinen für Leistungselektronik und mobile Produkte, nimmt seine 8″ Wafer-Fertigungslinie in Bucheon, Korea offiziell in Betrieb. Die neue Fab zeigt den Fokus des Unternehmens auf innovative Leistungshalbleiter-Lösungen. Sie ist eine Investition für bessere … Weiterlesen »

Jul
01

ERS introduces high-end chiller at Semicon West

ERS Electronic GmbH MUNICH, 1 July, 2013 – ERS electronic GmbH, the innovation leader for thermal wafer chucks in semiconductor production, will introduce advanced chilling technology for its AirCool3 modular thermal chuck system at the Semicon West in San Francisco. The new technology will enable ERS AirCool system to be used on 450mm wafer chucks … Weiterlesen »

Mai
28

ERS displays its innovative product spectrum at PSECE 2013 trade fair

ERS Electronic GmbH MUNICH, May 28, 2013 – ERS electronic GmbH, the innovation leader in the market of thermal wafer chucks in semiconductor production, will show its spectrum of wafer chuck systems at the Philippine Semiconductor and Electronics Convention and Exhibition (PSECE). In the spotlight of ERS’ presence at the event is the innovative ERS … Weiterlesen »

Dez
05

ERS FOWLP Competence Center now supporting a growing and diverse advanced packaging market

MUNICH – December 5, 2012 – One and half a year after its launch, ERS electronic GmbH’s FOWLP (Fan-out Wafer Level Packaging) competence center near Munich (Germany) is being utilized by an increasing number of semiconductor chip makers, research institutes, materials suppliers and packaging sub-contractors. The ERS lab provides the opportunity to utilize ERS’ latest … Weiterlesen »