MUNICH – May 05, 2011 – ERS electronic GmbH, market leader in the field of Thermal Wafer Chucks used in semiconductor production, these days celebrates its fortieth anniversary. The history of the company is a sequence of landmarks for increased productivity in semiconductor testing.
Thermal Wafer Chucks allow semiconductor manufacturers to conduct functional tests of integrated circuits under varying temperatures already at an early stage of production. Thus, the Thermal Wafer Chuck technology enables users to significantly increase their productivity and lower their costs. The technology has been invented by ERS. The company owns strategic intellectual property in this field and has continuously advanced the technology over its history.
Already with its first Thermal Wafer Chuck system products in the first half of the seventies of the 20th century, designed for the production of 2″ wafers, ERS attracted renowned technology leaders such as a major microprocessor manufacturer and the major automotive manufacturer in south Germany as its customers.
In the eighties, ERS invented the related AirCool technology – for its legendary reliability and performance it became a de-facto standard in the field of thermal wafer test technology. Among the customers were global semiconductor manufacturers. The AirCool product line established ERS‘ definitive technology leadership position in this segment of the semiconductor production. At the begin of the new millenium, this technology has been further developed and resulted in the AirCool plus product. This product has been patented and is globally the only low temperature solution based exclusively on the use of air as the coolant.
ERS‘ history as a company also reflects the progress of semiconductor manufacturing over the decades. At its inception, integrated circuits were produced on 2″ wafers, and ERS‘ first Chucks were designed for this wafer diameter. In 1978 ERS launched the 4″ Chuck for an automatic wafer prober; in 1990 the 8″ AirCool was introduced. Today’s leading edge product, the ERS 300mm PowerSense Chuck already represents the company’s second generation 12″ product. These ERS systems are installed at all major semiconductor manufacturers throughout the world.
ERS research is further perfecting the technology and turning it into products. While 8″ and 12″ production technology has reached a rather mature stage, ERS engineers already are working on next-generation production equipment required to process future 450mm wafers.
At the same time, the company has expanded its technology spectrum to other segments of semiconductor manufacturing. Strategic fields to further grow the company are advanced Wafer Level Packaging and Semiconductor Temperature Final Test (TriTemp Solutions). With its experienced staff and its excellent cutting-edge technological know-how, ERS is on the way to establish the same market-leading position as it already does in the Thermal Wafer Chuck segment.
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ERS electronic GmbH, located near Munich,is in its 40th year of supplying the most innovative thermal test solutions to the semiconductor industry. The most famous products are its fast-ramping and precise low-noise thermal chuck systems (-65°C to +500°C) for analytical, parametric and wafer sort probing up to 300mm.ERS also designs and builds stand-alone thermal-forcing systems and custom production tools for special applications. ERS invented the AirCool, AirCoolplus and PowerSense thermal chuck systems that have been fully integrated into all major manual, semi- and full automatic wafer probers.
ERS electronic GmbH
Klemens Reitinger
Stettinerstraße 3+5
82110 Germering
+49-89-8941320
kreitinger@ers-gmbh.de
Pressekontakt:
Brand+Image
Timothy K. Göbel
Kaagangerstr. 36
82279 Eching a.A.
ers@brandandimage.de
+49 8143 9926834
http://www.brandandimage.de